Electronic adhesives can be divided into heat curing, UV curing, anaerobic curing, wet curing, UV curing + heat curing, UV curing + wet curing, etc.
According to the material system can be divided into epoxy resins, acrylates and other.
Adhesives commonly used in electronic manufacturing include epoxy resin, UV (ultraviolet) glue, hot melt adhesive, solder paste, anaerobic adhesive, double group adhesive and so on. Epoxy resin is generally cured at high temperature, and the adhesion after curing is large, which is widely used in bonding of functional devices, Underfill and other processes.
