8368FC is a single-component heat-curing epoxy glue designed for sealing, protection and other applications in electronic devices. Very high adhesion and reliability on a variety of substrate surfaces such as FR4 and aluminum. At the same time, it also has excellent resistance to high temperature and moisture.
汽车
Epoxy adhesive system
Appearance: Grey
Density (g/ml) : 1.33
Viscosity: 10,000-14000cps
Open storage time, 25℃ : 48hrs
Effective use time (-20℃) : 6 months
Curing method: oven heating curing
Curing temperature: 150℃
Curing time: 5-7mins
Hardness Shore D: 80-90D
Body strength: > 63MPa
Glass transition temperature: 88℃
Coefficient of thermal expansion (CTE) :
CTE-1 (before curing) : 66 ppm/℃
CTE-2 (after curing) : 124 ppm/℃
Volume resistivity: 3.6x1015ω.cm
Key Features:
✓ Single-component system - Ready-to-use formulation requiring no mixing
✓ Low-temperature performance -Maintains bonding efficacy in sub-ambient conditions (tested to -40°C)
✓ Universal adhesion - Exceptional bonding strength across diverse substrates including:
- Metals (aluminum, stainless steel)
- Plastics (ABS, PC, PP with surface treatment)
- Composites and painted surfaces
