The role of industrial glue in manufacturing
      Mechanical and physical connection, which is the most basic function of glue. It can be considered from two aspects: one is to bear the load and transfer the external force; Here, the main role of glue is to fix the two parts tightly together, and can transfer the external force from one part to another, such as the blade and disk core of the chainsaw, which is glued together by glue, and the force (torque) in the working process of the chainsaw is transferred to the blade. In addition, the link between the motor rotor and the shaft is the same. In general, for the type of glue that bears the load, it should have extremely high bonding strength and good impact resistance, and at the same time, it has good sizing process and rapid curing characteristics;

      For the glue that plays the role of physical connection, mainly in the product assembly process, the parts or components of different materials, especially the parts with relatively small size, are often difficult or impossible to be assembled by other mechanical connections, so industrial glue is used for assembly. This kind of glue often has good dispensing control, that is, precision sizing can be achieved, and the curing speed is fast, and the reliability after bonding is high.

      The protective effect is another important function of glue in addition to the connection effect. With the improvement of people's living standards, electronic products, especially consumer electronic products, are increasingly playing an indispensable role in our daily life. There are a large number of components in electronic products, they are assembled in different ways on the PCB board or FPCB board, and as the product design is more and more miniaturized and lightweight, electronic components are constantly more integrated, the circuit is more and more compact, making the gap between the components and the foot spacing of the device itself smaller and smaller.

      At the same time, these components are often exposed to harsh environments, such as very wet bathrooms or special occasions with large dust, and even people want to use mobile phones to take photos or listen to music while swimming. All these changes and requirements make the entire circuit board or most components must be protected from short-circuit, corrosion or external extrusion failure in harsh environments! Glue plays an indispensable role in this protection, such as the three anti-adhesive and corner bonding adhesive that we often say, and the packaging adhesive of smart cards. In general, the requirements for this type of glue are fast curing speed, low corrosive ion content, high bonding fastness with different materials, and strong resistance to external forces.

      The multiple functions of glue are one of the important signs of the progress of the glue industry, such as the realization of material connection at the same time, but also to achieve a conductive role. Here, it also includes the conduction that replaces the solder function and the conduction that realizes the grounding function. Solder is the traditional wire connection, so that it can achieve a conductive connection, but its shortcomings are often large solder joints, occupy a high space, in the case of electronic components more and more thin, the use is limited. In addition, its connection depends on high temperature melting, so the product has a high temperature process, for those components or products that cannot withstand high temperatures, there is no development. To this end, the conductive adhesive can replace the solder, that is, to overcome its shortcomings, but also to achieve the dual role of connection and conduction.

      Of course, conductive adhesive according to its curing method can be divided into heating curing, room temperature curing and even UV curing type of conductive adhesive. Even if it is heated curing, the curing temperature of the general conductive adhesive will not exceed 150 degrees. In recent years, there have even been low-temperature curing conductive adhesives on the market, whose heating temperature does not exceed 80 degrees, which makes the application of conductive adhesives more extensive. In general, for the conductive adhesive with grounding function, it often requires high bonding fastness and fast curing speed, because its conductive particle content is not high, so the cost will be relatively low. At present, cost is an important factor restricting the promotion of conductive adhesives that require conduction. How to develop a conductive adhesive with low resistivity, low cost and high bonding strength is the direction of efforts of various suppliers.

      The continuous highly integrated, miniaturized, multi-functional and high-power electronic products make energy consumption and heat management become more and more prominent problems! These highly integrated components should not only be securely assembled on the PCB board, but also the heat generated by their work should be quickly dissipated; Sometimes in order to cool down, an additional radiator is installed on the surface of the component. In this case, thermal glue is the only choice.

      The thermal conductivity of glue can be understood from two different aspects: removing heat and absorbing heat, such as the glue glued to the heat sink should be able to quickly remove the heat; The thermal glue that protects the NTC temperature sensor should quickly absorb the heat and pass it to the chip. This is actually two aspects of the same problem, therefore, the biggest problem is the constant pursuit of high thermal conductivity and bonding fastness of the contradiction; There is also the effect of thermal conductive particle material added to achieve thermal conductivity on sizing process and rheological properties of glue.

      There are a variety of failure modes of electronic products, one of which is due to the greater external force, resulting in its components from the motherboard, or PIN foot cracking, etc., and can not work normally, such as FPC after bending and motherboard due to the elasticity of FPC and there is a long-term peeling force, under the long-term action of this peeling force, The conductive ACF that makes the connection produces unglued. Another example is the large capacitor in the fall process due to a large instantaneous impact force resulting in PIN foot cracking. To this end, the parts that may fail should be reinforced, the most simple and effective way is to use glue to reinforce, which includes the reinforcement of FPC, the reinforcement of large electronic devices such as capacitors, and the four corner binding of large chips. This kind of glue generally has a fast curing speed, good thixotropy, high bonding strength and good impact resistance and shock resistance.

      With the continuous extensive and in-depth use of industrial glue in various industries, its functions are becoming more and more diversified, and it shows that different industries also have their own demand characteristics, showing obvious special functions related to industry or product performance, and these special functions put forward new demands for glue. For example, in the optical and optical communication industry, it is required that the glue should have a very low shrinkage rate, good yellowing resistance, and the transmittance in a specific band should reach certain indicators. Again, some acoustic-related products also hope that the glue has a certain function of noise reduction and acoustic optimization; Also, some industries are eager to have long-term temperature resistance of 150 degrees or 180 degrees of UV glue and so on.

      Through the above analysis, it can be seen that glue, as one of the most traditional connection methods, has become more and more diversified and multi-functional in modern manufacturing, and this trend has injected infinite vitality and life into the adhesive industry, and also put forward new challenges!